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US 2020/0147929 A1Published application
High heat dissipating thin film and method for manufacturing same
AssigneeSolueta
InventorsEui Hong Min, Sang Ho Cho, Buck Keun Choi
Life of this patent
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Abstract
Provided is a high heat radiation thin film. The high heat radiation thin film may comprise a metal substrate, and a carbon layer which is disposed on the metal substrate and is thicker than 2.5 nm and thinner than 10 nm.
Claims14
A method of fabricating a high heat radiation thin film, the method comprising:
- preparing a metal substrate;
- forming a preliminary carbon layer by providing carbon ions onto the metal substrate;
- and
- forming a carbon layer on the metal substrate by heat-treating the metal substrate and the preliminary carbon layer,
- wherein the carbon layer has a thermal conductivity higher than a thermal conductivity of the preliminary carbon layer.
2 more elements
A method of fabricating a high heat radiation thin film including a carbon material, the method comprising:
- preparing a first metal film;
- and
- forming a first carbon layer coming into direct contact with a first surface of the first metal film,
- wherein the forming of the first carbon layer comprises providing carbon ions onto the first surface of the first metal film, and heat-treating the first metal film provided with the carbon ions.
1 more element
A high heat radiation thin film including a carbon material, the high heat radiation thin film comprising:
- a first metal film;
- and
- a first carbon layer coming into direct contact with a first surface of the first metal film,
- wherein the first carbon layer includes a graphitic carbon layer.
1 more element
Dependencies are inferred from the claim text.