SelfArray, Inc.
Troy, NY, US· latest recorded location
SelfArray, Inc. is named on 2 US grants and 6 published applications in this corpus. Its most frequent classification is H10H (Inorganic light-emitting semiconductor devices having potential barriers).
- Granted patents
- 2
- Published applications
- 6
- Inventors
- 4
- Granted in 2026 so far
- 0
- Most recent grant
- 4 Jan 2022
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2018 | 0 | 1 |
| 2019 | 1 | 3 |
| 2020 | 0 | 0 |
| 2021 | 0 | 2 |
| 2022 | 1 | 0 |
By publication year.
Technology areas
Share of 8 documents
- H10HInorganic light-emitting semiconductor devices having potential barriers4
- H10PGeneric processes or apparatus for the manufacture or treatment of devices covered4
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by3
- B08BCleaning in general2
- B29CShaping or joining of plastics2
- B32BLayered products, i.e. products built-up of strata of flat or non-flat2
- Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests2
- Y10TTechnical subjects covered by former us classification2
- B07CPostal sorting1
- B65GTransport or storage devices1
Recent patents
- Methods and systems for controlling temperature across a region defined by using thermally conductive elements4 Jan 2022US 11,214,015 B2
- Methods and systems for separating a plurality of directed self-assembled diamagnetic components29 Oct 2019US 10,457,032 B2
- Methods and systems for controlling temperature across a region defined by using thermally conductive elements25 Feb 2021US 2021/0053297 A1
- Method and system of stretching an acceptor substrate to adjust placement of a component25 Feb 2021US 2021/0057311 A1
- Methods and systems for sorting a plurality of components for directed self-assembly17 Jan 2019US 2019/0015873 A1
- Methods and systems for separating a plurality of directed self-assembled diamagnetic components17 Jan 2019US 2019/0016108 A1
- Design for a tessellated magnetic stage for the parallel assembly of diamagnetic components17 Jan 2019US 2019/0019717 A1
Most cited
By later US patents
None of its patents has been cited by a later US patent yet.