Multi Inc.
KANAGAWA, JP· latest recorded location
MULTI INC. is named on 0 US grants and 3 published applications in this corpus. Its most frequent classification is H05K (Printed circuits).
- Granted patents
- 0
- Published applications
- 3
- Inventors
- 7
- Granted in 2026 so far
- 0
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 2 |
By publication year.
Technology areas
Share of 3 documents
- H05KPrinted circuits3
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by2
- Y10TTechnical subjects covered by former us classification2
- C09JAdhesives1
- H10PGeneric processes or apparatus for the manufacture or treatment of devices covered1
- Y02PLow-carbon manufacturing1
Recent patents
No granted patents yet.
- Printed wiring board and method for manufacturing printed wiring board11 Jun 2009US 2009/0145630 A1
- Manufacturing method of printed wiring board and printed wiring board including potting dam obtained by using manufacturing method12 Mar 2009US 2009/0065242 A1
- Packing method for electronic components5 Oct 2006US 2006/0223231 A1
Most cited
By later US patents
None of its patents has been cited by a later US patent yet.