Motion Engine Inc.
Montreal, CA· latest recorded location
Motion Engine Inc. is named on 7 US grants and 12 published applications in this corpus. Its most frequent classification is B81B (Microstructural devices or systems).
- Granted patents
- 7
- Published applications
- 12
- Inventors
- 2
- Granted in 2026 so far
- 1
- Most recent grant
- 24 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2016 | 1 | 2 |
| 2017 | 0 | 3 |
| 2018 | 0 | 3 |
| 2019 | 3 | 1 |
| 2020 | 0 | 1 |
| 2021 | 0 | 0 |
| 2022 | 1 | 0 |
| 2023 | 1 | 0 |
| 2024 | 0 | 1 |
| 2025 | 0 | 0 |
| 2026 | 1 | 1 |
By publication year. 2026 runs to 8 Oct.
Technology areas
Share of 19 documents
- B81BMicrostructural devices or systems15
- B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural12
- G01CMeasuring distances, levels or bearings8
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by6
- G01PMeasuring linear or angular speed, acceleration, deceleration, or shock4
- G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure3
- G01RMeasuring electric variables3
- B64UUnmanned aerial vehicles [uav]1
- G01DMeasuring not specially adapted for a specific variable1
- G01SRadio direction-finding1
Recent patents
- 3D mems device with hermetic cavity24 Feb 2026US RE50,807 E1
- MEMS motion sensor and method of manufacturing26 Dec 2023US 11,852,481 B2
- 3D MEMS magnetometer and associated methods29 Mar 2022US 11,287,486 B2
- 3D MEMS device with hermetic cavity10 Sep 2019US 10,407,299 B2
- MEMS components and method of wafer-level manufacturing thereof30 Apr 2019US 10,273,147 B2
- Resonant mems device12 Mar 2026US 2026/0071873 A1
- Mems motion sensor and method of manufacturing27 Jun 2024US 2024/0210174 A1
- Mems pressure sensor23 Jul 2020US 2020/0232860 A1
- Methods and systems for motion determination of sensor elements in sensor systems using mems imus28 Feb 2019US 2019/0064364 A1
- Mems components and method of wafer-level manufacturing thereof20 Dec 2018US 2018/0362330 A9
Most cited
By later US patents
- 3D MEMS device and method of manufacturing12US 9,309,106 B22016
- 3D MEMS device with hermetic cavity7US 10,407,299 B22019
- Integrated MEMS system6US 10,214,414 B22019
- MEMS components and method of wafer-level manufacturing thereof6US 10,273,147 B22019
- 3D MEMS magnetometer and associated methods4US 11,287,486 B22022