Mdm
Daegu, KR· latest recorded location
MDM is named on 2 US grants and 3 published applications in this corpus. Its most frequent classification is H05K (Printed circuits).
- Granted patents
- 2
- Published applications
- 3
- Inventors
- 1
- Granted in 2026 so far
- 0
- Most recent grant
- 22 Oct 2019
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2018 | 1 | 0 |
| 2019 | 1 | 1 |
| 2020 | 0 | 2 |
By publication year.
Technology areas
Share of 5 documents
Recent patents
- PCB module having multi-sided heat sink structure and multilayer PCB assembly for use in same22 Oct 2019US 10,455,697 B2
- Multi-layer PCB having function of dissipating heat from power semiconductor module package and PCB, and production method thereof27 Mar 2018US 9,930,815 B2
- Method for forming circuit pattern on surface of three-dimensional structure4 Jun 2020US 2020/0178396 A1
- Method for forming multilayered circuit pattern on surface of three-dimensional metal board4 Jun 2020US 2020/0178399 A1
- PCB Module Having Multi-Sided Heat Sink Structure And Multilayer PCB Assembly For Use In Same30 May 2019US 2019/0166691 A1
Most cited
By later US patents