PCB module having multi-sided heat sink structure and multilayer PCB assembly for use in same

A PCB module having a multi-directional heat radiation structure, the PCB module comprising:

• a multilayer PCB assembly having a layered structure in which a plurality of electrically insulating heat radiation plates and a plurality of PCBs are stacked alternately layer by layer;
• and an upper case and a lower case configured to cover an upper surface and a lower surface of the multilayer PCB assembly, respectively, wherein at least one of an uppermost layer or a lowermost layer of the multilayer PCB assembly is a PCB layer, wherein at least one heat radiation plate of the plurality of heat radiation plates comprises:
• a first heat pole configured to be in thermal contact with an electronic circuit element mounted on the PCB layer of the uppermost layer or the lowermost layer of the multilayer PCB assembly;
• and a second heat pole configured to be in thermal contact with an inner surface of at least one of the upper and lower cases, wherein a first concavo-convex shape is formed on an outer surface of at least one case of the upper and lower cases, and wherein the PCB module further comprises a heat radiation structure having a second concavo-convex shape attached to the outer surface of the at least one case to be engaged with the first concavo-convex shape in contact therewith.