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US 2020/0178399 A1Published application
Method for forming multilayered circuit pattern on surface of three-dimensional metal board
AssigneeMdm
InventorKu Yong Kim
Life of this patent
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Abstract
A method for forming a multilayered circuit pattern on a surface of a 3D metal board includes: forming a first insulation layer on the surface of the 3D metal board; forming a first conductive pattern on the first insulation layer; forming a second insulation layer on the first conductive pattern except for a predetermined region; forming a second conductive pattern on the second insulation layer; and forming a third insulation layer on the second conductive pattern except for one or more circuit element mounting regions.
Claims12
A method for forming a multilayered circuit pattern on a surface of a 3D metal board, the method comprising:
- forming a first insulation layer on the surface of the 3D metal board;
- forming a first conductive pattern on the first insulation layer;
- forming a second insulation layer on the first conductive pattern except for a predetermined region;
- forming a second conductive pattern on the second insulation layer;
- and
- forming a third insulation layer on the second conductive pattern except for one or more circuit element mounting regions.
3 more elements
Dependencies are inferred from the claim text.