Interplex QLP, Inc.
College Point, NY, US· latest recorded location
Interplex QLP, Inc. is named on 4 US grants and 1 published applications in this corpus. Its most frequent classification is H10W (Generic packages, interconnections, connectors or other constructional details of devices covered by).
- Granted patents
- 4
- Published applications
- 1
- Inventors
- 4
- Granted in 2026 so far
- 0
- Most recent grant
- 18 Oct 2011
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2010 | 3 | 0 |
| 2011 | 1 | 1 |
By publication year.
Technology areas
Share of 5 documents
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by5
- Y10TTechnical subjects covered by former us classification3
- H10FSolar cells and light sensors2
- H10HInorganic light-emitting semiconductor devices having potential barriers2
- B29CShaping or joining of plastics1
- B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding1
- C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds1
Recent patents
Most cited
By later US patents