Back to results
US 7,679,185 B2Granted
Microcircuit package having ductile layer
AssigneeInterplex QLP, Inc.
InventorsMichael A. Zimmerman, Jonathan Harris
Life of this patent
Estimating the term…
Abstract
A microcircuit package having a ductile layer between a copper flange and die attach. The ductile layer absorbs the stress between the flange and semiconductor device mounted on the flange, and can substantially reduce the stress applied to the semiconductor device. In addition, the package provides the combination of copper flange and polymeric dielectric with a TCE close to copper, which results in a low stress structure of improved reliability and conductivity.
Claims21
A microcircuit package comprising:
- a substrate having a first surface, said substrate formed of copper, a copper alloy, silver or a silver alloy;
- a layer of ductile material having a first surface and a second surface, the first surface of the layer attached to the first surface of the substrate;
- a barrier layer having a first surface and a second surface, the first surface of the barrier layer attached to the second surface of the layer of ductile material;
- a gold layer having a first surface and a second surface, the first surface of the gold layer attached to the second surface of the barrier layer;
- and
- a eutectic layer having a first surface and a second surface, the first surface of the eutectic layer attached to the second surface of the gold layer, said eutectic layer formed of a gold-tin (AuSn) alloy, a gold-silicon (AuSi) alloy or a gold-germanium (AuGe) alloy, said first surface of said eutectic layer for mounting a semiconductor die thereon.
3 more elements
A microcircuit package comprising:
- a substrate having a first surface, said substrate formed of copper, a copper alloy, silver or a silver alloy;
- a layer of ductile material having a first surface and a second surface, the first surface of the layer attached to the first surface of the substrate;
- a barrier layer having a first surface and a second surface, the first surface of the barrier layer attached to the second surface of the layer of ductile material;
- a gold layer having a first surface and a second surface, the first surface of the gold layer attached to the second surface of the barrier layer;
- and
- a eutectic layer having a first surface and a second surface, the first surface of the eutectic layer attached to the second surface of the gold layer, said eutectic layer formed of a lead free material selected from the group of a tin-silver-copper (SnAgCu) alloy, a tin-silver (SnAg) alloy, an antimony-tin (SbSn) alloy, a tin-zinc (SnZn) alloy, a tin-indium (SnIn) alloy and bismuth (Bi), said first surface of said eutectic layer for mounting a semiconductor die thereon.
3 more elements
Dependencies are inferred from the claim text.