Exitech Limited
Oxford, GB· latest recorded location
Exitech Limited is named on 5 US grants and 5 published applications in this corpus. Its most frequent classification is B23K (Soldering or unsoldering).
- Granted patents
- 5
- Published applications
- 5
- Inventors
- 10
- Granted in 2026 so far
- 0
- Most recent grant
- 12 Nov 2013
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2003 | 1 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 1 |
| 2008 | 1 | 2 |
| 2009 | 0 | 1 |
| 2010 | 0 | 0 |
| 2011 | 1 | 0 |
| 2012 | 0 | 0 |
| 2013 | 2 | 0 |
By publication year.
Technology areas
Share of 10 documents
Recent patents
- Laser processing apparatus, laser processing head and laser processing method12 Nov 2013US 8,581,140 B2
- Process and apparatus for ablation1 Jan 2013US 8,344,285 B2
- Laser processing apparatus and laser processing method as well as debris extraction mechanism and debris extraction method4 Jan 2011US 7,863,542 B2
- Method for laser micromachining13 May 2008US 7,371,993 B2
- Method and apparatus for drilling microvia holes in electrical circuit interconnection packages10 Jun 2003US 6,576,869 B1
- Process for laser scribing30 Jul 2009US 2009/0188543 A1
- Method for laser micromachining2 Oct 2008US 2008/0237206 A1
- Process and Apparatus for Ablation21 Feb 2008US 2008/0041832 A1
- Laser processing apparatus and laser processing method as well as debris extraction mechanism and debris extraction method28 Jun 2007US 2007/0145026 A1
- Positioning method, apparatus and a product thereof7 Sep 2006US 2006/0196852 A1
Most cited
By later US patents
- Method and apparatus for drilling microvia holes in electrical circuit interconnection packages59US 6,576,869 B12003
- Laser processing apparatus and laser processing method as well as debris extraction mechanism and debris extraction method11US 7,863,542 B22011
- Process and apparatus for ablation10US 8,344,285 B22013
- Method for laser micromachining4US 7,371,993 B22008
- Laser processing apparatus, laser processing head and laser processing method4US 8,581,140 B22013