Laser processing apparatus, laser processing head and laser processing method

A laser processing apparatus for performing pattern processing of a transparent conductive film on a multilayer film formed on a processing object by using laser light, comprising:

• a laser processing head including:
• a transmission window for transmitting laser light by which said processing object is irradiated;
• a grouping of gas inlets and outlets consisting of:
• an opening portion for passing the laser light transmitted through said transmission window to a bottom portion of said laser processing head,
• an outlet hole for discharging an atmosphere to the outside, the outlet hole being positioned at a top portion of the laser processing head and away from a surface of the processing object,
• a first vent hole for directing gas into the vicinity of the laser light irradiated region of said processing object, the first vent hole positioned adjacent to the surface of the processing object near the bottom portion of the laser processing head, and
• a second vent hole provided for discharging the gas in the vicinity of the laser light irradiated region of said processing object to the outside, the second vent hole positioned adjacent to the surface of the processing object near the bottom portion of the laser processing head and at a position opposed to the first vent hole, the second vent hole positioned directly below the outlet hole;
• and
• a gas flowing groove peripherally located at the bottom portion of said laser processing head, and
• a rotation mechanism that is provided with said first and second vent holes and that has a rotational axis approximately parallel with an optical path of said laser light,
• wherein debris generated from the laser light irradiated region of said processing object is discharged upwardly through the opening portion of the laser processing head and out of the outlet hole, and out of the second vent hole, both the outlet hole and the second vent hole being continuous with said opening portion provided at the bottom portion of said laser processing head,
• wherein the rotational mechanism is configured to change a gas inlet-to-outlet direction between said first vent hole and said second vent hole in the vicinity of said laser light irradiated region of said processing object by rotating said rotation mechanism correspondingly with a change in the pattern processing direction of said processing object, and
• wherein a horizontal gas flow direction is in the direction from the first vent hole to the second vent hole or from the second vent hole to the first vent hole, and the grouping of gas inlets and outlets are arranged such that within each of the interiors of the laser processing head, the first vent hole, the second vent and the outlet hole, at least substantially none of the gas flows in a direction opposite to the horizontal gas flow direction.