EPIC Technology Inc.
Salt Lake City, UT, US· latest recorded location
EPIC Technology Inc. is named on 1 US grants and 9 published applications in this corpus. Its most frequent classification is H01R (Electrically-conductive connections).
- Granted patents
- 1
- Published applications
- 9
- Inventors
- 7
- Granted in 2026 so far
- 0
- Most recent grant
- 25 Sep 2012
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2004 | 0 | 2 |
| 2005 | 0 | 4 |
| 2006 | 0 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 1 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 1 |
By publication year.
Technology areas
Share of 10 documents
- H01RElectrically-conductive connections6
- H05KPrinted circuits3
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by3
- G06QInformation and communication technology [ict] specially adapted for administrative, commercial, financial, managerial2
- G16HHealthcare informatics, i.e. information and communication technology [ict] specially adapted for the2
- A23LFoods, foodstuffs or non-alcoholic beverages, not otherwise provided for1
- A23PShaping or working of foodstuffs, not fully covered by a single other1
- B23PMetal-working not otherwise provided for1
- Y10TTechnical subjects covered by former us classification1
Recent patents
- Resistant Starch Food Bar System9 Jul 2015US 2015/0189901 A1
- Systems and methods for obtaining health and financial information with a handheld device16 Jun 2011US 2011/0139868 A1
- Interposer with compliant pins5 Jan 2006US 2006/0000642 A1
- Contact and method for making same22 Sep 2005US 2005/0204538 A1
- Die package with higher useable die contact pad area22 Sep 2005US 2005/0205988 A1
Most cited
By later US patents