3Dmmic LLC.
Taoyuan City, TW· latest recorded location
3DMMIC LLC. is named on 0 US grants and 3 published applications in this corpus. Its most frequent classification is H10W (Generic packages, interconnections, connectors or other constructional details of devices covered by).
- Granted patents
- 0
- Published applications
- 3
- Inventors
- 4
- Granted in 2026 so far
- 0
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2025 | 0 | 1 |
| 2026 | 0 | 2 |
By publication year. 2026 runs to 8 Oct.
Technology areas
Share of 3 documents
Recent patents
No granted patents yet.
Most cited
By later US patents
None of its patents has been cited by a later US patent yet.