Manufacturing method of electronic device

Abstract

A manufacturing method of an electronic device includes separately forming first and second portions from first and second wafers and forming a signal processing circuit by bonding the first portion to the second portion. Forming the first portion includes forming active devices from a semiconductor epitaxial structure grown on a first substrate of the first wafer and forming a first bonding structure over the first substrate and electrically coupled to the active devices. Forming the second portion includes forming passive devices over a second substrate of the second wafer, forming through substrate vias (TSVs) in the second substrate, and forming a second bonding structure electrically coupled to the passive devices. The TSVs are electrically coupled to the passive devices and the active devices are electrically coupled to the passive devices by bonding the first bonding structure to the second bonding structure to form the signal processing circuit.

Dependencies are inferred from the claim text.