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US 9,006,861 B2Granted
Integrated circuit device
AssigneeKabushiki Kaisha Toshiba
InventorsKenji Yamada, Hideki Kimijima
Life of this patent
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Abstract
An integrated circuit device includes a fuse in which a pair of terminal portions connected to different conductive components is provided on both sides of a cuttable portion that is cut as needed by being irradiated with laser light, the cuttable portion and the pair of terminal portions being integrally formed. The cuttable portion may be thinner than the terminal portions.
Claims19
An integrated circuit device comprising:
- an interconnection circuit having a first and a second conductor;
- and
- a fuse extending between, and selectively electrically interconnecting the first and second conductor, wherein the fuse includes
- a first terminal portion in electrical and physical contact with the first conductor;
- a second terminal portion in electrical and physical contact with the second conductor;
- and
- a cuttable portion extending between the first terminal portion and the second terminal portion,
- wherein the volume of the cuttable portion is at least 20 times smaller than the total volume of the first terminal portion and the second terminal portion.
5 more elements
An integrated circuit device comprising
- a fuse having a pair of terminal portions, the terminal portions are provided on both sides of a cuttable portion that is cut as needed by being irradiated with laser light, the cuttable portion and the pair of terminal portions being integrally formed, wherein
- the width of the terminal portions is greater than the width of the cuttable portion, and
- the total volume of the pair of terminal portions is 20 or more times greater than the volume of the cuttable portion.
Dependencies are inferred from the claim text.