Method for fabricating semiconductor device

A method for fabricating a semiconductor device, comprising steps as follows:

• providing a device wafer;
• forming a patterned bonding layer in order to align with a scribe line region of the device wafer, wherein the scribe line region has at least one recess, the patterned bonding layer is in contact with a bottom of the recess, and the patterned bonding layer has a thickness substantially greater than a depth of the recess;
• bonding a handle wafer to the device wafer by the patterned bonding layer;
• and
• performing a dicing process along the scribe line region in order to divide the device wafer into a plurality of dices and thoroughly remove the patterned bonding layer simultaneously with the dicing process, whereby the divided dices can be separated from the handle wafer.