Electroless copper compositions
AssigneeRohm and Haas Electronic Materials LLC
InventorsMark A. Poole, Andrew J. Cobley, Amrik Singh, Deborah V. Hirst
Life of this patent
Estimating the term…
Abstract
Electroless copper and copper alloys plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright or copper alloy on substrates.
Claims8
A composition comprising one or more sources of copper ions, one or more chelating agents selected from the group consisting of hydantoin and hydantoin derivatives and 20 g/L to 80 g/L of one or more reducing agents selected from the group consisting of fructose esters, the composition is formaldehyde free.
A method comprising:
- a) providing a substrate;
- and
- b) electrolessly depositing copper on the substrate with an electroless copper composition comprising one or more sources of copper ions, one or more chelating agents selected from the group consisting of hydantoin and hydantoin derivatives and 20 g/L to 80 g/L of one or more reducing agents selected from the group consisting of fructose esters, the electroless copper composition is formaldehyde free.
A method comprising:
- a) providing a printed wiring board comprising a plurality of through-holes;
- b) desmearing the through-holes;
- and
- c) depositing copper on walls of the through-holes with an electroless copper bath comprising one or more sources of copper ions, one or more chelating agents selected from the group consisting of hydantoin and hydantoin derivatives and 20 g/L to 80 g/L of one or more reducing agents selected from the group consisting of fructose esters, the electroless copper bath is formaldehyde free.
Dependencies are inferred from the claim text.