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US 7,611,552 B2Granted
Semiconductor polishing composition
AssigneeNitta Haas Incorporated
InventorsYoshiharu Ohta, Yasuyuki Itai
Life of this patent
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Abstract
A semiconductor polishing composition is disclosed. The composition includes fumed silica. The semiconductor polishing composition is an aqueous dispersion solution of fumed silica. Further, the number of particles of fumed silica having a particle diameter of 0.5 μm or more is 600,000 pieces/ml or less and the number of particles of fumed silica having a particle diameter of 1 μm or more is 6000 pieces/ml or less.
Claims4
A semiconductor polishing composition comprising:
- fumed silica, the semiconductor polishing composition being an aqueous dispersion solution of fumed silica,
- wherein the number of particles of fumed silica having a particle diameter of 0.5 μm or more is in a range of 10,000 to 600,000 pieces/ml and the number of particles of fumed silica having a particle diameter of 1 μm or more is in a range of 500 to 6000 pieces/ml.
Dependencies are inferred from the claim text.