Immersion cooling coolant and electronic device using this coolant
AssigneeFujitsu Limited
InventorsMitsutaka Yamada, Kishio Yokouchi, Nobuo Kamehara, Koichi Niwa
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Abstract
A coolant for cooling a semiconductor element by direct immersion, cooling, which has an improved cooling capability, is disclosed. The coolant comprises a low boiling point fluorocarbon having a boiling point of 30.degree. C. to 100.degree. C. and a high boiling point fluorocarbon having a boiling point higher than that of the low boiling point fluorocarbon by at least 100.degree. C.; an amount of the high boiling point fluorocarbon being less than 20% by volume, based on the volume of the low boiling point fluorocarbon.
Claims9
A boiling cooling-type electronic device for using at a temperature in a range of room temperature to 80.degree. C., comprising an electronic element having a heat generating portion immersed in a liquid coolant, the liquid coolant comprising a low boiling point fluorocarbon having a boiling point of 30.degree. C. to 100.degree. C. and a high boiling point fluorocarbon having a boiling point of 150.degree. C. to 260.degree. C. and higher than that of the low boiling point fluorocarbon by at least 100.degree. C., an amount of the high boiling point fluorocarbon being from 1.5% by volume to 20% by volume, based on the volume of the low boiling point fluorocarbon.
Dependencies are inferred from the claim text.