Method and apparatus for deforming a j-shaped lead of a packaged semiconductor device

An apparatus for deforming a J-shaped lead of a packaged semiconductor device, wherein the J-shaped lead comprises a straight extended portion, a straight lead portion and a curved tip portion, wherein the J-shaped lead extends from a main body of the packaged semiconductor device by the straight extended portion along a first direction which is parallel to a plane of a first major surface of the packaged semiconductor device, wherein the straight lead portion is at a first angle to the straight extended portion and connected between the straight extended portion and the curved tip portion, and wherein the curved tip portion is curved toward a direction perpendicular to the first direction, the apparatus comprising:

• a force component;
• and
• a pusher component,
• wherein the force component is configured to be movable along a second direction which is perpendicular to the first direction,
• wherein the movement of the force component along the second direction is convertible into a movement of the pusher component along a third direction which is opposite to the first direction by means of a transfer mechanism, wherein the pusher component is configured to be in contact with the curved tip portion, and
• wherein during the pusher component is in contact with the curved tip portion, the movement of the pusher component along the third direction results in an inward movement of the curved tip portion relative to the main body of the packaged semiconductor device, thereby deforming the J-shaped lead.