US 2025/0149434 A1 · CAPACITORS WITH FLOATING METAL LAYERS

Abstract

The disclosed subject matter relates generally to capacitors in semiconductor devices and integrated circuit (IC) chips. More particularly, the present disclosure relates to a metal-dielectric-metal capacitor having electrically floating metal layers and an interconnect level that is devoid of any metal layers. The present disclosure provides a capacitor having a first interconnect level above a substrate, a first plurality of metal layers in the first interconnect level, a second interconnect level above the first interconnect level, a second plurality of metal layers in the second interconnect level, in which the metal layers in the second plurality of metal layers are electrically floating, a third interconnect level above the second interconnect level, the third interconnect level is devoid of any metal layers, a fourth interconnect level above the third interconnect level, and a third plurality of metal layers in the fourth interconnect level.

Claims20

Dependent claims

A capacitor comprising:

a first interconnect level above a substrate;
a first plurality of metal layers in the first interconnect level;
a second interconnect level above the first interconnect level;
a second plurality of metal layers in the second interconnect level, wherein the metal layers in the second plurality of metal layers are electrically floating;
a third interconnect level above the second interconnect level, the third interconnect level is devoid of any metal layers;
a fourth interconnect level above the third interconnect level;
and
a third plurality of metal layers in the fourth interconnect level.

5 more elements

A capacitor comprising:

a first interconnect level above a substrate;
a first plurality of metal layers in the first interconnect level;
a second interconnect level above the first interconnect level;
a second plurality of metal layers in the second interconnect level, the second plurality of metal layers includes a first position metal layer and a last position metal layer, wherein the metal layers in the second plurality of metal layers are not connected to a voltage source or a current source;
a third interconnect level above the second interconnect level, the third interconnect level includes a metal-less region that is devoid of any metal layers, the metal-less region has opposing peripheral sides bounded by at least a vertical plane taken from a distal top edge of the first position metal layer in the second plurality of metal layers and a vertical plane taken from at a distal top edge of the last position metal layer in the second plurality of metal layers;
a fourth interconnect level above the third interconnect level;
and
a third plurality of metal layers in the fourth interconnect level.

5 more elements

Dependencies are inferred from the claim text.

Capacitors with floating metal layers

Life of this patent

Capacitors with floating metal layers

Life of this patent

Abstract

Claims20