Heat dissipation structure for heating element

Abstract

According to an embodiment of the present disclosure, a heat dissipation structure for a heating element is provided, wherein the heat dissipation structure uses a heat sink and includes: a plate; the heating element comprising a housing configured to have one surface attached to the plate and a heating unit positioned inside the housing and emitting heat; a vapor chamber positioned in close contact with the heating element and configured to receive and diffuse the heat emitted from the heating element; a thermal pad configured to transfer the heat received from the vapor chamber to the heat sink; and the heat sink attached to the thermal pad and configured to emit the heat received from the thermal pad.

Dependencies are inferred from the claim text.