Template, method for manufacturing template, and method for manufacturing semiconductor device

A method for manufacturing a template capable of transferring a pattern to a resin applied to a substrate, the method comprising:

• processing a surface of a base material to form a mesa portion protruding from the base material;
• forming a plurality of protruding portions including a first protruding portion and a second protruding portion, in which a protrusion amount of the second protruding portion with respect to the reference plane is smaller than a protrusion amount of the first protruding portion with respect to the reference plane;
• and
• treating a top surface of the second protruding portion so that a surface area of the top surface of the second protruding portion is larger than a surface area of a top surface of the first protruding portion.

A method for manufacturing a semiconductor device comprising:

• transferring a pattern to a resin applied on a substrate by using a template, wherein the template comprises:
• a base material;
• and
• a mesa portion protruding from a surface of the base material, wherein
• the mesa portion includes a plurality of protruding portions protruding from a reference plane of the mesa portion,
• the plurality of protruding portions include at least a first protruding portion and a second protruding portion, in which a protrusion amount of the second protruding portion with respect to the reference plane is smaller than a protrusion amount of the first protruding portion with respect to the reference plane, and
• a surface area of a top surface of the second protruding portion is larger than a surface area of a top surface of the first protruding portion;
• forming a patterned resist;
• and
• processing the substrate based on the patterned resist.