Three layer system in package and a method of enabling thereof

A 3 layer opto-electronic engine 100, comprising:

• a first layer 101 that includes:
• a plurality of processors 104, and
• a plurality of optoelectronic connectors 707, wherein the plurality of optoelectronic connectors 717 is arranged to surround the plurality of processors 104;
• a second layer 103 that is connected to the first layer 101, wherein
• the second layer 103 includes:
• a first surface 123 that faces the first layer 101, and
• a second surface 125 that is opposite to the first surface 123,
• the first surface 123 includes:
• a plurality of first memories 709A, and
• a plurality of first electronic components 124, and
• the second surface 125 includes:
• a plurality of second memories 709B that is different from the plurality of first memories 709A, and
• a plurality of second electronic components 126 that is different from the plurality of first electronic components 124;
• and
• a third layer 105 connected to at least one the first layer 101 or the second layer 103, wherein
• the third layer 105 includes:
• a first surface 127 that faces the second layer 103, and
• a second surface 129 that is opposite to the first face 127 of the third layer 105,
• the first surface 127 of the third layer 105 includes a plurality of third electronic components 128 that is different from the plurality of first electronic components 124 and the plurality of second electronic components 126, and
• the second surface 129 of the third layer 105 includes a plurality of fourth electronic components 130 that is different from the plurality of first electronic components 124, the plurality of second electronic components 126, and the plurality of third electronic components 128.