Micro electromechanical system sensor and method of forming the same

A micro electromechanical system (MEMS) package comprising:

• a MEMS section attached to a substrate;
• a cap bonded to a first surface of the substrate;
• a carrier bonded to a second surface of the substrate opposite the first surface, wherein the carrier is free of active devices, and the cap and the carrier define a vacuum region surrounding the MEMS section;
• a bond pad on a surface of the carrier opposite the MEMS section, wherein the bond pad is electrically connected to the MEMS section;
• an active circuit wafer, the active circuit wafer comprising an active circuit substrate and an interconnect structure, the interconnect structure bonded to the surface of the carrier opposite the MEMS section at an interface, wherein the carrier is positioned to block outgassing from the interconnect structure from entering the vacuum region;
• and
• a conductive element through the active circuit substrate, the conductive element configured to transfer a signal to external circuitry.

A method of making a micro electromechanical system (MEMS) package, the method comprising:

• patterning a substrate to form a MEMS section;
• bonding a cap to a first surface of the substrate;
• bonding a carrier to a second surface of the substrate opposite the first surface, wherein the carrier is free of active devices, and the cap and the carrier define a vacuum region surrounding the MEMS section;
• and
• forming a bond pad on a surface of the carrier opposite the MEMS section, wherein the bond pad is electrically connected to the MEMS section.