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AssigneeInternational Business Machines Corporation
InventorsTimothy H. Daubenspeck, Ekta Misra, Marie-Claude Paquet, Francis Santerre, Wolfgang Sauter
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Embodiments of the invention provide a semiconductor chip having a passivation layer extending along a surface of a semiconductor substrate to an edge of the semiconductor substrate, and methods for their formation. One aspect of the invention provides a semiconductor chip comprising: a semiconductor substrate; a passivation layer including a photosensitive polyimide disposed along a surface of the semiconductor substrate and extending to at least one edge of the semiconductor substrate; and a channel extending through the passivation layer to the surface of the semiconductor substrate.
A semiconductor chip comprising:
A method of forming a semiconductor chip, the method comprising:
A method of forming a passivation layer on a semiconductor substrate, the method comprising:
Dependencies are inferred from the claim text.