US 2009/0288855 A1 · POSITIVE-TYPE RADIATION-SENSITIVE RESIN COMPOSITION FOR PRODUCING A METAL-PLATING FORMED MATERIAL, TRANSCRIPTION FILM AND PRODUCTION METHOD OF A METAL-PLATING FORMED MATERIAL

Abstract

The positive-type radiation-sensitive resin composition for producing a metal-plating formed material relating to the present invention comprises (A) a polymer containing a structural unit having an acid-dissociative functional group, which is dissociated in the presence of an acid to generate an acidic functional group, and a crosslinking structure; (B) a radiation-sensitive acid generator; and (C) an organic solvent. The positive-type radiation-sensitive resin composition is excellent in sensitivity and resolution, exhibits excellent adhesion to a substrate, leaves no residue at an opening after development, and is capable of preventing occurrence of crack in the resin film after metal plating and push-in of plated metal into the resin film.

Claims8

Dependent claims

A production method of a metal-plating formed material comprising:

(1) forming a resin film by using a positive-type radiation-sensitive resin composition on a wafer provided with a barrier metal layer, the composition comprising the following components (A) to (C):
(A) a polymer comprising a structural unit having an acid-dissociative functional group, which is dissociated in the presence of an acid to generate an acidic functional group, and a crosslinking structure;
(B) a radiation-sensitive acid generator;
and
(C) an organic solvent;
(2) forming a pattern by exposing the resin film followed by developing;
(3) depositing an electrode material by electroplating with the pattern as a template;
and
(4) removing the barrier metal layer by etching after peeling the remaining resin film off.

6 more elements

Dependencies are inferred from the claim text.

Facts

Application

12/512,211Filed 30 Jul 2009

Priority

JP 2005-2259693 Aug 2005

Published

26 Nov 2009

Term ends

Not estimatedThe source records don’t support an estimate.

Classification4 codes

G03F 7/0392
Macromolecular compounds which are photodegradable, e.g. positive electron resists: the macromolecular compound being present in a chemically…
H10W 72/012
Manufacture or treatment: of bump connectors, dummy bumps or thermal bumps
G03F
Photomechanical production of textured or patterned surfaces
H10W
Generic packages, interconnections, connectors or other constructional details of devices covered by

Positive-type radiation-sensitive resin composition for producing a metal-plating formed material, transcription film and production method of a metal-plating formed material

Life of this patent

Positive-type radiation-sensitive resin composition for producing a metal-plating formed material, transcription film and production method of a metal-plating formed material

Life of this patent

Abstract

Claims8