Semiconductor integrated circuit device
OwnerOsamu TONOMURA, Hiroshi MIKI +2inventors
InventorsOsamu TONOMURA, Hiroshi MIKI, Tomoko SEKIGUCHI, Kenichi TAKEDA
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OwnerOsamu TONOMURA, Hiroshi MIKI +2inventors
InventorsOsamu TONOMURA, Hiroshi MIKI, Tomoko SEKIGUCHI, Kenichi TAKEDA
Estimating the term…
A DRAM capacitor uses ruthenium or ruthenium oxide as an upper electrode and hafnium dioxide or zirconium oxide as an insulation layer. The DRAM capacitor is intended to suppress diffusion of ruthenium, etc. into hafnium dioxide. Tantalum pentoxide or niobium oxide having a higher permittivity than that of the insulation layer is inserted as a cap insulation layer to the boundary between the upper electrode of ruthenium or ruthenium oxide and the insulation layer of hafnium dioxide or zirconium oxide to thereby suppress diffusion of ruthenium, etc. into hafnium dioxide, etc.
A semiconductor integrated circuit device, comprising, above a semiconductor substrate:
A semiconductor integrated circuit device, comprising, above a semiconductor substrate:
Dependencies are inferred from the claim text.