Encapsulation component for integrated micro electromechanical systems and fabrication process of the component

Abstract

The microsystems are integrated in a first cavity bounded by at least a substrate and by a top wall formed by at least a part of a first cover. The component has a second cavity bounded by at least the whole of the top wall of the first cavity and by a second cover formed by a thin layer. The second cover can be covered by a coating made of plastic material molded from a casting. The fabrication process of the component comprises deposition, on the whole of the top wall of the first cavity, of a layer of polymer material and annealing of the layer of polymer material. The layer of polymer material acts as sacrificial layer for deposition of the thin layer designed to form the second cover.

Dependencies are inferred from the claim text.