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AssigneeMicron Technology, Inc.
InventorWarren M. Farnworth
Estimating the term…
A multi-chip module (MCM) that fails testing after its assembly is repaired by generating a wire-bonding solution for a repair die during testing, storing the repair solution in a computer system in association with a unique ID code read from the MCM, and then using the repair solution at a wire-bonding station to correctly bond out a repair die for the MCM. The use of a stored repair solution at the wire-bonding station eliminates the need for a human operator to manually select the repair solution, and thus reduces the opportunity for error while shortening the length of time it takes to complete the repair process.
A method of making a multi-chip module (MCM), the method comprising:
A method of making a multi-chip module (MCM), the method comprising:
A method of wire-bonding at least one repair die in a multi-chip module (MCM), the method comprising wire-bonding the at least one repair die in accordance with a wire-bonding repair solution generated during prior testing of the MCM.
A method of repairing a multi-chip module (CM) including at least one defective integrated circuit (IC) die, the method comprising:
A method of repairing a multi-chip module (MCM) having at least one defective integrated circuit (IC) die, the method comprising:
Dependencies are inferred from the claim text.