Polishing solution and polishing method
AssigneeResonac Corporation
InventorsYuya Otsuka, Hisataka Minami, Shingo Kobayashi, Mayumi Komine, Hisato Takahashi
Life of this patent
Estimating the term…
Loading patent…
AssigneeResonac Corporation
InventorsYuya Otsuka, Hisataka Minami, Shingo Kobayashi, Mayumi Komine, Hisato Takahashi
Estimating the term…
A polishing liquid containing: abrasive grains containing a metal oxide; at least one hydroxy acid compound selected from the group consisting of a hydroxy acid having a structure represented by General Formula (A1) below and a salt thereof; and water: [In the formula, R11 represents a hydrogen atom or a hydroxy group, R12 represents a hydrogen atom, an alkyl group, or an aryl group, n11 represents an integer of 0 or more, and n12 represents an integer of 0 or more; however, a case where both of R11 and R12 are a hydrogen atom is excluded.]
A polishing liquid comprising:
Dependencies are inferred from the claim text.