Impinging jet manifold for chip cooling near edge jets

A coolant delivery manifold, comprising:

• a top surface including at least one supply cavity and at least one return cavity;
• and
• a bottom surface including an inner cavity and a surrounding outer cavity,
• wherein each of the at least one supply cavities includes an opening between a bottom portion of the supply cavity and at least one of the inner cavity or the surrounding outer cavity on the bottom surface, the opening adapted for transmission of fluid at a first temperature through the supply cavity to the inner cavity and transmission of a fluid at a second temperature different than the first temperature to the surrounding outer cavity, and
• wherein the at least one return cavity includes a plurality of apertures between the inner cavity on the bottom surface and the top surface, the plurality of apertures sized to receive a plurality of fluid return tubes.

An assembly, comprising:

• an orifice plate having top and bottom surfaces, and a plurality of supply and return apertures, and a plurality of return tubes, each return aperture feeding into one of the return tubes, the bottom surface of the orifice plate adapted to seal to a top surface of a semiconductor containing circuitry, the plurality of supply and return apertures in fluid communication with the circuitry when the orifice plate and substrate are sealed together, and
• a gasket,
• a manifold having top and bottom surfaces, a first supply cavity in fluid communication with a first portion of the plurality of supply apertures, a second cavity in fluid communication with a second portion of the plurality of supply apertures, and at least one return cavity in fluid communication with the entirety of the plurality of return apertures through the return tubes;
• and
• a sealing member adapted to create a hermetic seal between the orifice plate and the manifold;
• wherein the bottom surface of the orifice plate has at least one first cavity that is in fluid communication with the first portion of the plurality of supply apertures and some of the return apertures, the first cavity having an internal wall about a perimeter of the cavity, and a second cavity separated from the at least one first cavity by the gasket such that the gasket hermetically seals a first chip component of the circuitry from a second chip component of the circuitry when the bottom surface of the orifice plate is sealed to the top surface of the semiconductor at a position where the at least one first cavity extends over the first chip component and the second cavity extends over the second component, the second cavity being in fluid communication with the second portion of the plurality of supply apertures and some of the return apertures, and
• wherein at least some of the plurality of supply apertures are proximate the internal wall of the at least one cavity.