Y10T 83/4617
Work feed means modified to maintain clearance from tool
Y10T83/4617 (Work feed means modified to maintain clearance from tool) appears on 12 US grants and 5 published applications in this corpus.
Search patents in Y10T- Granted patents
- 12
- Published applications
- 5
- Assignees
- 9
- Inventors
- 18
- Latest grant
- 10 Aug 2010
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 2 |
| 2003 | 1 | 1 |
| 2004 | 1 | 0 |
| 2005 | 1 | 0 |
| 2006 | 0 | 1 |
| 2007 | 0 | 1 |
| 2008 | 1 | 0 |
| 2009 | 0 | 0 |
| 2010 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Substrate dividing system, substrate manufacturing equipment, substrate scribing method and substrate dividing method10 Aug 2010US 7,770,500 B2Mitsuboshi Diamond Industrial Co., Ltd.
- Substrate-cutting system, substrate-producing apparatus, substrate-scribing method, and substrate-cutting method23 Sep 2008US 7,426,883 B2
- Sawing device for sheets of wood, plastic or the like18 Oct 2005US 6,955,108 B2GreCon Dimter Holzoptimierung Süd GmbH & Co. KG
- Supply device for supplying rubber material to a cutting device28 Dec 2004US 6,834,823 B2VMI EPE Holland B.V.
- Apparatus for cutting and sorting diagnostic strips6 May 2003US 6,557,446 B2Kinematic Automation, Inc.
- Substrate Dividing System, Substrate Manufacturing Equipment, Substrate Scribing Method and Substrate Dividing Method6 Dec 2007US 2007/0281444 A1Mitsuboshi Diamond Industrial Co., Ltd.
- Substrate-cutting system, substrate-producing apparatus, substrate-scribing method, and substrate-cutting method29 Jun 2006US 2006/0137504 A1
- Supply device for supplying rubber material to a cutting device15 May 2003US 2003/0089207 A1VMI EPE Holland B.V.
- Sawing device for sheets of wood, plastic or the like31 Oct 2002US 2002/0157518 A1GreCon Dimter Holzoptimierung Süd GmbH & Co. KG
- Apparatus for cutting and sorting diagnostic strips26 Sep 2002US 2002/0134210 A1Kinematic Automation, Inc.
Most cited
By later US patents
- Apparatus for cutting laminated sheet material11US 4,916,992 AKabushiki Kaisha Kawakami Seisakusho · 1990
- Optimizing cutoff saw11US 5,181,445 AUltimizer's Inc. · 1993
- Apparatus for cutting laminated sheet material10US 5,018,418 AKabushiki Kaisha Kawakami Seisakusho · 1991
- Device for portioning foodstuffs, in particular ground meat, to be packed in trays or the like8US 6,351,927 B1Refin S.r.l. · 2002
- Substrate-cutting system, substrate-producing apparatus, substrate-scribing method, and substrate-cutting method7US 7,426,883 B22008