Y10T 83/0429
By compressing
Y10T83/0429 (By compressing) appears on 98 US grants and 32 published applications in this corpus.
Search patents in Y10T- Granted patents
- 98
- Published applications
- 32
- Assignees
- 73
- Inventors
- 141
- Latest grant
- 2 Apr 2019
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 1 | 0 |
| 1985 | 4 | 0 |
| 1986 | 4 | 0 |
| 1987 | 8 | 0 |
| 1988 | 3 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 3 | 0 |
| 1992 | 6 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 3 | 0 |
| 1999 | 4 | 0 |
| 2000 | 6 | 0 |
| 2001 | 4 | 0 |
| 2002 | 2 | 2 |
| 2003 | 3 | 3 |
| 2004 | 1 | 0 |
| 2005 | 1 | 3 |
| 2006 | 2 | 2 |
| 2007 | 1 | 2 |
| 2008 | 1 | 0 |
| 2009 | 0 | 4 |
| 2010 | 1 | 1 |
| 2011 | 3 | 7 |
| 2012 | 1 | 2 |
| 2013 | 3 | 2 |
| 2014 | 3 | 3 |
| 2015 | 1 | 1 |
| 2016 | 1 | 0 |
| 2017 | 2 | 0 |
| 2018 | 0 | 0 |
| 2019 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Method of flattening the edges of a swatch of flexible material to be cut2 Apr 2019US 10,245,741 B2Lectra
- Quick cutter1 Aug 2017US 9,717,254 B2
- Blunt tip vial access cannula and method for manufacture25 Jul 2017US 9,713,573 B2Covidien LP
- Apparatus for making bodily fluid absorbent pad19 Apr 2016US 9,314,379 B2Unicharm Corporation
- Gas flow passage forming member, method of manufacturing the gas flow passage forming member, and device for forming the gas flow passage forming member13 Oct 2015US 9,160,026 B2Toyota Jidosha Kabushiki Kaisha
- Method of flattening the edges of a swatch of flexible material to be cut30 Jul 2015US 2015/0209971 A1Lectra
- Quick cutter18 Sep 2014US 2014/0260847 A1
- Book trimming apparatus15 May 2014US 2014/0130648 A1IBIS Integrated Bindery Systems Ltd.
- Blunt tip vial access cannula and method for manufacture27 Feb 2014US 2014/0053953 A1Covidien LP
- Wafer cutting method and device1 Aug 2013US 2013/0192435 A1STMicroelectronics (Tours) SAS
Most cited
By later US patents
- Support pad and method of manufacture121US 4,603,445 ASpan-America Medical Systems, Inc. · 1986
- Support pad and method of manufacture88US 4,700,447 ASpan-America Medical Systems, Inc. · 1987
- Method of forming a slit in a reseal element for a needleless injection site63US 6,177,037 B1Becton, Dickinson and Company · 2001
- Three dimensional surface shaping of synthetic foam pads by continuous rotary process57US 5,534,208 AFoamex L.P. · 1996
- Method of cutting compressible materials47US 5,129,295 AOntario Die Company Limited · 1992