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US 2013/0192435 A1Published application
Wafer cutting method and device
AssigneeSTMicroelectronics (Tours) SAS
InventorsVincent Jarry, Philippe Prunet, Thierry Feuillette
Life of this patent
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Abstract
A device for cutting a wafer provided with grooves on its upper surface having its lower surface supported by a flexible film secured to a frame. This device includes a system for locating the grooves and for positioning the frame with respect to a cutting system, and setting means for positioning the wafer in front of the locating system so that the located area is at a determined distance from the locating system.
Claims19
A method for cutting a wafer, comprising:
- making at least a portion of the wafer more planar by pressing a bearing element against a second surface of the wafer, the portion of the wafer being proximate a first groove on a first surface of the wafer;
- aligning the wafer with a cutting blade so that the cutting blade is located proximate the second surface of the wafer that is opposite the first groove;
- and
- cutting the wafer along the first groove.
1 more element
A device for cutting a wafer, comprising:
- a cutting system;
- a locating system configured to locate grooves on an upper surface of the wafer and position the wafer with respect to the cutting system;
- and
- means for making at least a portion of the wafer more planar.
1 more element
A wafer cutting device, comprising:
- a cutting system having a blade configured to cut a wafer along a groove located on an upper surface of the wafer;
- a locating system configured to locate the groove on the upper surface of the wafer and position the groove with respect to the blade of the cutting system;
- and
- a bearing element configured to press against a lower surface of the wafer proximate the groove causing at least a portion of the wafer to be more planar.
1 more element
Dependencies are inferred from the claim text.