Y10T 408/29
Cutting by use of rotating axially moving tool: with means to deform
Official title: with means to deForm work temporarily
Y10T408/29 (Cutting by use of rotating axially moving tool: with means to deform) appears on 20 US grants and 5 published applications in this corpus.
Search patents in Y10T- Granted patents
- 20
- Published applications
- 5
- Assignees
- 13
- Inventors
- 44
- Latest grant
- 6 Jun 2017
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 2 |
| 2011 | 0 | 1 |
| 2012 | 0 | 0 |
| 2013 | 1 | 1 |
| 2014 | 2 | 1 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Drilling apparatus and drilling method6 Jun 2017US 9,669,472 B2Fuji Jukogyo Kabushiki Kaisha
- Drilling tool11 Nov 2014US 8,882,410 B2The Boeing Company
- Drilling system and method29 Jul 2014US 8,790,050 B2Airbus Operations GmbH
- Substrate transfer apparatus and substrate treatment system26 Mar 2013US 8,403,601 B2Tokyo Electron Limited
- Controlled breaking of cables in a well casing2 Oct 2001US 6,296,053 B1Subsurface Technology Corporation
- Drilling apparatus and drilling method27 Nov 2014US 2014/0348603 A1Fuji Jukogyo Kabushiki Kaisha
- Drilling tool28 Feb 2013US 2013/0051945 A1The Boeing Company
- Drilling system and method6 Oct 2011US 2011/0243676 A1AIRBUS OPERATIONS (inc as a Societe par Act Simpl)
- Drilling in stretched substrates4 Nov 2010US 2010/0276505 A1
- Substrate transfer apparatus and substrate treatment system19 Aug 2010US 2010/0211215 A1Tokyo Electron Limited
Most cited
By later US patents
- Tapered extrusion die and method of forming the same42US 4,287,749 AFord Motor Company · 1981
- Method of forming suction swab27US 5,085,633 ASage Products, LLC · 1992
- Pipeline repair method and apparatus20US 5,052,431 A1991
- Stringer clip end effector18US 5,127,139 AThe Boeing Company · 1992
- Drilling system and method17US 8,790,050 B2Airbus Operations GmbH · 2014