Y10S 428/941
Solid state alloying
Official title: Solid state alloying, e.g. diffusion, to disappearance of an original layer
Y10S428/941 (Solid state alloying) appears on 101 US grants and 30 published applications in this corpus.
Search patents in Y10S- Granted patents
- 101
- Published applications
- 30
- Assignees
- 60
- Inventors
- 237
- Latest grant
- 27 Jan 2015
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 12 | 0 |
| 1977 | 2 | 0 |
| 1978 | 3 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 3 | 0 |
| 1982 | 3 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 6 | 0 |
| 1991 | 2 | 0 |
| 1992 | 4 | 0 |
| 1993 | 0 | 0 |
| 1994 | 3 | 0 |
| 1995 | 6 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 5 | 0 |
| 2001 | 6 | 2 |
| 2002 | 11 | 7 |
| 2003 | 8 | 2 |
| 2004 | 4 | 9 |
| 2005 | 3 | 4 |
| 2006 | 3 | 1 |
| 2007 | 0 | 0 |
| 2008 | 0 | 2 |
| 2009 | 2 | 2 |
| 2010 | 1 | 0 |
| 2011 | 1 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 1 |
| 2014 | 0 | 0 |
| 2015 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Tin-plated copper-alloy material for terminal and method for producing the same27 Jan 2015US 8,940,404 B2Mitsubishi Materials Corporation
- Whisker-free lead frames6 Sep 2011US 8,013,428 B2LSI Corporation
- Copper bonding or superfine wire with improved bonding and corrosion properties12 Jan 2010US 7,645,522 B2W. C. Heraeus GmbH
- Low-sulfur article having a platinum aluminide protective layer and its preparation31 Mar 2009US 7,510,779 B2General Electric Company
- Component with a platinum-aluminum substrate area, platinum-aluminum coating and production method24 Feb 2009US 7,494,719 B2MTU Aero Engines AG
- Tin-plated copper-alloy material for terminal and method for producing the same1 Aug 2013US 2013/0196171 A1Mitsubishi Materials Corporation
- Whisker-free lead frames26 Nov 2009US 2009/0291321 A1LSI Corporation
- Low temperature reactive composite joining5 Feb 2009US 2009/0035542 A1
- Component with a platinum-aluminum substrate area, platinum-aluminum coating and production method25 Sep 2008US 2008/0233427 A1MTU Aero Engines AG
- Copper Bonding or Superfine Wire with Improved Bonding and Corrosion Properties27 Mar 2008US 2008/0076251 A1W. C. Heraeus GmbH
Most cited
By later US patents
- Low temperature reactive bonding79US 5,381,944 AThe Regents of the University of California · 1995
- Freestanding reactive multilayer foils60US 6,736,942 B2The Johns Hopkins University · 2004
- Method of forming aluminide coatings on nickel-, cobalt-, and iron-base alloys57US 3,979,273 AUnited Technologies Corporation · 1976
- Method for improving metallurgical bond in bimetallic castings43US 4,008,052 ATRW Inc. · 1977
- Transition metal aluminum/aluminide coatings42US 5,292,594 ALiburdi Engineering Limited · 1994