Copper bonding or superfine wire with improved bonding and corrosion properties
AssigneeW.C. Heraeus GmbH
InventorsAlbrecht Bischoff, Heinz Förderer, Lutz Schräpler, Frank Krüger
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Abstract
A bonding or superfine wire is provided made of copper, with a gold enrichment on the surface thereof, in particular in an amount corresponding to a coating of at most 50 nm. The wire may be bonded by the ball/wedge method, has a copper-colored appearance, and the ball thereof after flame-off has a hardness of less than 95 according to HV0.002. In order to produce the bonding or superfine wire, a copper wire is coated with gold or a copper-gold alloy or gold is introduced into the surface of the copper wire. The wires are bonded to a semiconductor silicon chip.
Claims14
A bonding or superfine wire, comprising a copper wire having gold enriched in a surface of the wire, wherein the bonding or superfine wire comprises a single phase system.
A bonding or superfine wire, comprising a copper wire containing gold in its surface, wherein the bonding or superfine wire comprises a single phase system and is bondable using a ball/wedge process.
A ball/wedge process, the process comprising bonding a bonding or superfine wire made of copper onto a semiconductor silicon chip, wherein the wire is enriched with gold in its surface and comprises a single phase system.
A process for improving corrosion resistance of a bonding or superfine wire made of copper, the process comprising treating the copper wire with gold on its surface during manufacture of the bonding or superfine wire such that the treated bonding or superfine wire comprises a single phase system.
Dependencies are inferred from the claim text.