Y10S 29/001
Method or apparatus involving adhesive
Y10S29/001 (Method or apparatus involving adhesive) appears on 37 US grants and 19 published applications in this corpus.
Search patents in Y10S- Granted patents
- 37
- Published applications
- 19
- Assignees
- 24
- Inventors
- 69
- Latest grant
- 12 May 2015
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 3 | 3 |
| 2002 | 2 | 4 |
| 2003 | 2 | 4 |
| 2004 | 8 | 0 |
| 2005 | 3 | 4 |
| 2006 | 3 | 2 |
| 2007 | 0 | 0 |
| 2008 | 0 | 1 |
| 2009 | 0 | 0 |
| 2010 | 1 | 0 |
| 2011 | 1 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 1 |
| 2015 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Liquid adhesive application by contact printing12 May 2015US 9,027,247 B2Xerox Corporation
- Method of manufacturing head unit30 Aug 2011US 8,006,383 B2Brother Kogyo Kabushiki Kaisha
- Method of making a micro-fluid ejection device6 Apr 2010US 7,690,115 B2Lexmark International, Inc.
- Method of manufacturing an ink jet print head26 Dec 2006US 7,153,442 B2Seiko Epson Corporation
- Process for manufacturing a micro-fluid ejection device16 May 2006US 7,043,838 B2Lexmark International, Inc.
- Liquid adhesive application by contact printing24 Apr 2014US 2014/0109408 A1Xerox Corporation
- Method of manufacturing head unit13 Mar 2008US 2008/0060198 A1Brother Kogyo Kabushiki Kaisha
- Die attach methods and apparatus for micro-fluid ejection device28 Sep 2006US 2006/0213060 A1Lexmark International, Inc.
- Die attach methods and apparatus for micro-fluid ejection device5 Jan 2006US 2006/0000090 A1Lexmark International, Inc.
- Method of producing a temperature-dependent switch with stamped-on adhesive layer29 Dec 2005US 2005/0285711 A1
Most cited
By later US patents
- Radio frequency identification tag apparatus and related method452US 6,265,977 B1Motorola, Inc. · 2001
- Integrated circuit assembly and method of assembly95US 6,094,138 AMotorola, Inc. · 2000
- Process for the production of laminated cores34US 6,629,358 B2Thyssen Transrapid System GmbH · 2003
- Using fusible films having windows supplied with adhesive and gap material33US 5,872,583 ASeiko Epson Corporation · 1999
- Laminate tile pole piece for an MRI, a method manufacturing the pole piece and a mold bonding pole piece tiles23US 6,259,252 B1General Electric Company · 2001