Integrated circuit assembly and method of assembly
AssigneeMotorola, Inc.
InventorsNoel H. Eberhardt, Victor Allen Vega
Life of this patent
Estimating the term…
Abstract
An integrated circuit assembly (12) such as used on a radio frequency identification tag, or other device, includes an integrated circuit (14) coupled to first and second printed conductors (16a) and (16b), such as tag electrodes, on a flexible substrate (18). The printed conductors (16a and 16b) may be conductors in the form of printed ink electrostatic antennas. The integrated circuit (14), is disposed in a generally co-planar arrangement with the flexible substrate (18). That is, the integrated circuit (14) is positioned in-line with the flexible substrate (18).
Claims20
An integrated circuit (IC) assembly comprising:
- a flexible substrate, having a thickness that defines a plane, supporting at least one conductor;
- an integrated circuit disposed in a coplanar arrangement with the flexible substrate, wherein the integrated circuit is substantially within the plane;
- and
- isotropic electrically conductive material coupled between the conductor and the integrated circuit to form an electrical connection therebetween.
An integrated circuit (IC) assembly comprising:
- a flexible substrate, supporting at least one conductor, wherein the flexible substrate includes paper;
- an integrated circuit disposed in a coplanar arrangement with the flexible substrate;
- and
- isotropic electrically conductive material coupled between the conductor and the integrated circuit to form an electrical connection therebetween.
An integrated circuit (IC) assembly comprising:
- a flexible substrate supporting at least one conductor;
- an integrated circuit disposed in a coplanar arrangement with the flexible substrate, and
- isotropic electrically conductive material coupled between the conductor and the integrated circuit to form an electrical connection therebetween, wherein the isotropic electrically conductive material includes pressure sensitive conductive tape.
An integrated circuit (IC) assembly comprising:
- a flexible substrate supporting at least one conductor;
- an integrated circuit disposed in a coplanar arrangement with the flexible substrate, and
- isotropic electrically conductive material coupled between the conductor and the integrated circuit to form an electrical connection therebetween, wherein non-conductive tape is attached to the flexible substrate and to a surface of the coplanar integrated circuit.
An integrated circuit (IC) assembly comprising:
- a flexible substrate supporting at least two conductors formed from conductive ink;
- an integrated circuit disposed in a coplanar arrangement with the flexible substrate;
- and
- isotropic electrically conductive material coupled between the at least two conductors and the integrated circuit to form an electrical connection therebetween such that the two conductors are electrically isolated from one another and each conductor is electrically coupled with the integrated circuit.
A method of making an IC assembly comprising the steps of:
- locating an integrated circuit in a co-planar manner with a substrate that supports at least one conductor, wherein the substrate has a thickness that defines a plane and the integrated circuit is substantially within the plane;
- and
- applying an isotropic electrically conductive material between the integrated circuit and the at least one conductor to form an electrical connection therebetween.
Dependencies are inferred from the claim text.