Y10S 165/217
Space for coolant surrounds space for vapor
Y10S165/217 (Space for coolant surrounds space for vapor) appears on 23 US grants and 5 published applications in this corpus.
Search patents in Y10S- Granted patents
- 23
- Published applications
- 5
- Assignees
- 14
- Inventors
- 27
- Latest grant
- 25 May 2010
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 3 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 4 |
| 2009 | 0 | 0 |
| 2010 | 4 | 0 |
By publication year. Applications have been published since 2001.
Subgroups
Granted patents
Recent patents
- Semiconductor-based porous structure enabled by capillary force25 May 2010US 7,723,760 B2University of Cincinnati
- System and method of a heat transfer system with an evaporator and a condenser25 May 2010US 7,723,845 B2University of Cincinnati
- Porous semiconductor-based evaporator having porous and non-porous regions, the porous regions having through-holes27 Apr 2010US 7,705,342 B2University of Cincinnati
- Integrated thermal systems6 Apr 2010US 7,692,926 B2Progressive Cooling Solutions, Inc.
- Moving bed dryer11 Dec 2001US 6,328,099 B1Mississippi Chemical Corporation
- Integrated thermal systems5 Jun 2008US 2008/0128898 A1Progressive Cooling Solutions, Inc.
- Semiconductor-based porous structure22 May 2008US 2008/0115912 A1University of Cincinnati
- Method of fabricating semiconductor-based porous structure22 May 2008US 2008/0115913 A1
- System and method of a heat transfer system and a condensor15 May 2008US 2008/0110598 A1Progressive Cooling Solutions, Inc.
- Silicon mems based two-phase heat transfer device3 May 2007US 2007/0095507 A1University of Cincinnati
Most cited
By later US patents
- Integrated thermal systems32US 7,692,926 B2Progressive Cooling Solutions, Inc. · 2010
- Vapor condensing apparatus24US 4,129,180 AHudson Products Corporation · 1978
- Air-cooled steam condenser20US 4,513,813 ANuovo Pignone S.p.A. · 1985
- Air cooled condenser20US 5,632,329 AGEA Power Cooling Systems, Inc. · 1997
- Freeze protected, air-cooled vacuum steam condensers19US 4,926,931 A1990