H05K 7/2059
Within rooms for removing heat from cabinets
Official title: {within rooms for removing heat from cabinets, e.g. by air conditioning device}
H05K7/2059 (Within rooms for removing heat from cabinets) appears on 57 US grants and 77 published applications in this corpus.
Search patents in H05K- Granted patents
- 57
- Published applications
- 77
- Assignees
- 59
- Inventors
- 158
- Latest grant
- 17 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1997 | 2 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 0 | 2 |
| 2003 | 4 | 2 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 2 |
| 2008 | 0 | 3 |
| 2009 | 0 | 4 |
| 2010 | 0 | 3 |
| 2011 | 2 | 2 |
| 2012 | 1 | 11 |
| 2013 | 1 | 5 |
| 2014 | 3 | 1 |
| 2015 | 4 | 1 |
| 2016 | 4 | 5 |
| 2017 | 4 | 3 |
| 2018 | 2 | 8 |
| 2019 | 8 | 6 |
| 2020 | 5 | 5 |
| 2021 | 6 | 1 |
| 2022 | 4 | 1 |
| 2023 | 0 | 3 |
| 2024 | 2 | 4 |
| 2025 | 2 | 3 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Automated cooling requirement determination for computing environments20 Aug 2026US 2026/0247579 A1NVIDIA Corporation
- Optimized evaporative dry cooling arrangement for a datacenter1 Jan 2026US 2026/0006752 A1Ovh
- Devices, systems and methods relating to underfloor cubic support systems (ucfss) for raised access floors (raf)18 Dec 2025US 2025/0386461 A1Global Integrated Flooring Solutions
- Airflow management system for power module2 Oct 2025US 2025/0311169 A1Schneider Electric It Corporation
- Temperature-controlled enclosure for containing temperature-sensitive electronic and/or telecommunications equipment24 Jul 2025US 2025/0240914 A1Energy Cool Aps
Most cited
By later US patents
- Method and device for cooling in closed spaces106US 5,671,805 ATelefonaktiebolaget LM Ericsson · 1997
- Modular low profile cooling system33US 6,644,384 B2Liebert Corporation · 2003
- Datacenter aisle containment structure26US 9,072,193 B1Amazon Technologies, Inc. · 2015
- Modular liquid-cooled air conditioning system18US 6,662,588 B2Vantage Equipment Corp. · 2003
- Side-cooled modular data center18US 9,814,160 B2Baselayer Technology, LLC · 2017