H05H 1/2487
The plasma being activated using mechanical actuators
Official title: {the plasma being activated using mechanical actuators}
H05H1/2487 (The plasma being activated using mechanical actuators) appears on 7 US grants and 9 published applications in this corpus.
Search patents in H05H- Granted patents
- 7
- Published applications
- 9
- Assignees
- 3
- Inventors
- 8
- Latest grant
- 17 Jun 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2010 | 0 | 2 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 1 | 1 |
| 2014 | 0 | 1 |
| 2015 | 1 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 1 |
| 2021 | 2 | 1 |
| 2022 | 0 | 1 |
| 2023 | 1 | 0 |
| 2024 | 1 | 1 |
| 2025 | 1 | 1 |
By publication year.
Recent patents
- Plasma source and method for removing materials from substrates utilizing pressure waves17 Jun 2025US 12,334,301 B2Atmospheric Plasma Solutions, Inc.
- Efficient mechanical generation of cavitation in liquids1 Oct 2024US 12,104,625 B2The Texas A&M University System
- Plasma source and method for removing materials from substrates utilizing pressure waves7 Nov 2023US 11,810,756 B2AP Solutions, Inc.
- Efficient mechanical generation of cavitation in liquids7 Dec 2021US 11,193,513 B2The Texas A&M University System
- Plasma source and method for removing materials from substrates utilizing pressure waves20 Apr 2021US 10,984,984 B2AP Solutions, Inc.
- Plasma source and method for removing materials from substrates utilizing pressure waves9 Oct 2025US 2025/0316449 A1Atmospheric Plasma Solutions, Inc.
- Plasma source and method for removing materials from substrates utilizing pressure waves15 Feb 2024US 2024/0055224 A1Atmospheric Plasma Solutions, Inc.
- Efficient mechanical generation of cavitation in liquids24 Feb 2022US 2022/0056934 A1The Texas A&M University System
- Plasma source and method for removing materials from substrates utilizing pressure waves17 Jun 2021US 2021/0183617 A1Atmospheric Plasma Solutions, Inc.
- Efficient mechanical generation of cavitation in liquids6 Feb 2020US 2020/0040921 A1The Texas A&M University System
Most cited
By later US patents
- Plasma source and method for removing materials from substrates utilizing pressure waves2US 10,984,984 B2AP Solutions, Inc. · 2021
- Plasma source and method for removing materials from substrates utilizing pressure waves2US 11,810,756 B2AP Solutions, Inc. · 2023
- Plasma source with integral blade and method for removing materials from substrates2US 8,981,251 B2AP Solutions, Inc. · 2015