Plasma source and method for removing materials from substrates utilizing pressure waves

A method for removing a material from a substrate on which the material is disposed, the method comprising:

• generating, by a plasma-generating chamber having a plasma-generating region, a non-thermal plasma at atmospheric pressure, the plasma comprising an energetic species reactive with one or more components of the material, wherein the plasma-generating chamber contains a dielectric structure located against an interior wall of the plasma-generating chamber and through which the gas passes;
• providing a powered electrode extending through the dielectric structure and extending partially into the plasma-generating region of the plasma generating chamber which is beside the dielectric structure through which the gas passes, and the electrode being coupled to a power source configured to power to the atmospheric pressure, non-thermal plasma;
• and
• providing a plasma outlet downstream from the electrode, communicating with the plasma-generating chamber, and out-letting the plasma to outside the chamber;
• and
• wherein the atmospheric pressure, non-thermal plasma plume comprising energetic plasma species emitted from the plasma outlet at a supersonic velocity into an ambient environment outside the atmospheric pressure plasma source,
• wherein, with the power source powering the atmospheric pressure, non-thermal plasma, the plasma plume outside the atmospheric pressure plasma source comprises periodic regions of pressure waves of high plasma density and low plasma density, and
• wherein the regions of high plasma density outside the atmospheric pressure plasma source comprise shockwaves effective for enhancing removal of material from a substrate with which the plasma plume having the periodic regions of high plasma density and low plasma density interacts.