H04L 2027/0022
Using the carrier of the associated receiver of a transceiver
Official title: {using the carrier of the associated receiver of a transceiver}
H04L2027/0022 (Using the carrier of the associated receiver of a transceiver) appears on 54 US grants and 51 published applications in this corpus.
Search patents in H04L- Granted patents
- 54
- Published applications
- 51
- Assignees
- 35
- Inventors
- 127
- Latest grant
- 15 Aug 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 2 |
| 2002 | 3 | 4 |
| 2003 | 4 | 2 |
| 2004 | 4 | 4 |
| 2005 | 1 | 2 |
| 2006 | 3 | 2 |
| 2007 | 3 | 1 |
| 2008 | 1 | 3 |
| 2009 | 2 | 2 |
| 2010 | 2 | 2 |
| 2011 | 3 | 4 |
| 2012 | 0 | 1 |
| 2013 | 7 | 5 |
| 2014 | 5 | 4 |
| 2015 | 4 | 1 |
| 2016 | 2 | 1 |
| 2017 | 2 | 5 |
| 2018 | 2 | 0 |
| 2019 | 2 | 1 |
| 2020 | 0 | 1 |
| 2021 | 1 | 1 |
| 2022 | 1 | 0 |
| 2023 | 1 | 1 |
| 2024 | 0 | 0 |
| 2025 | 0 | 1 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Coarse and fine compensation for frequency error15 Aug 2023US 11,729,040 B2Cypress Semiconductor Corporation
- Systems and methods for die-to-die communication22 Nov 2022US 11,509,346 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Systems and methods for die-to-die communication17 Aug 2021US 11,095,333 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Systems and methods for die-to-die communication15 Oct 2019US 10,447,328 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Transmitter with compensating mechanism of pulling effect6 Aug 2019US 10,374,643 B2Realtek Semiconductor Corp.
- Compressed Long Range Physical Layer Protocol Data Unit (PPDU)21 May 2026US 2026/0142770 A1Ofinno, LLC
- Frequency modulated continuous wave based synchronization signal11 Dec 2025US 2025/0379773 A1QUALCOMM Incorporated
- Coarse and fine compensation for frequency error30 Mar 2023US 2023/0097689 A1Cypress Semiconductor Corporation
- Systems and Methods for Die-to-Die Communication4 Nov 2021US 2021/0344374 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Systems and Methods for Die-to-Die Communication6 Feb 2020US 2020/0044680 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Radio frequency control for communications systems118US 6,463,266 B1Broadcom Corporation · 2002
- Radio frequency control for communication systems72US 6,985,705 B2Broadcom Corporation · 2006
- Communication terminal device and channel estimating method25US 7,002,939 B1Matsushita Electric Industrial Co., Ltd. · 2006
- Radio frequency control for communication systems21US 6,816,716 B2Broadcom Corporation · 2004
- Chiprate correction in digital transceivers14US 7,133,647 B2Ericsson Inc. · 2006