Systems and methods for die-to-die communication
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHuan-Neng Chen, Chewn-Pu Jou, Feng-Wei Kuo, Lan-Chou Cho, William Wu Shen
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHuan-Neng Chen, Chewn-Pu Jou, Feng-Wei Kuo, Lan-Chou Cho, William Wu Shen
Estimating the term…
Systems and methods for die-to-die communication are provided. A first transceiver disposed on a first die includes a transmission section configured to modulate first data onto a carrier signal having a first frequency. The first transceiver includes a reception section configured to receive signals from a transmission line. The reception section includes a filter configured to pass frequencies within a first passband that includes a second frequency. The first frequency is outside of the first passband. A second transceiver is disposed on a second die and is configured to communicate with the first transceiver via the transmission line. The second transceiver includes a transmission section configured to modulate second data onto a carrier signal having the second frequency. The second transceiver includes a reception section including a filter configured to pass frequencies within a second passband that includes the first frequency. The second frequency is outside of the second passband.
A system for simultaneous bidirectional die-to-die communications, the system comprising:
A method for simultaneously and bidirectionally communicating data between two dies, the method comprising:
A simultaneous bidirectional communications system, comprising:
Dependencies are inferred from the claim text.