H03H 7/251
The element being a thermistor
Official title: {the element being a thermistor}
H03H7/251 (The element being a thermistor) appears on 9 US grants and 10 published applications in this corpus.
Search patents in H03H- Granted patents
- 9
- Published applications
- 10
- Assignees
- 7
- Inventors
- 11
- Latest grant
- 26 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 1 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 1 | 1 |
| 2009 | 2 | 1 |
| 2010 | 0 | 1 |
| 2011 | 1 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 1 | 2 |
| 2019 | 1 | 0 |
| 2020 | 0 | 0 |
| 2021 | 1 | 1 |
| 2022 | 0 | 1 |
| 2023 | 0 | 0 |
| 2024 | 0 | 1 |
| 2025 | 0 | 1 |
| 2026 | 1 | 0 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Systems and methods for frequency equalization and temperature compensation in radio frequency devices26 May 2026US 12,640,701 B2Smiths Interconnect Americas, Inc.
- Digital step attenuator14 Sep 2021US 11,121,702 B1Chengdu Sicore Semiconductor Corp. Ltd.
- Temperature compensated digital step attenuator30 Apr 2019US 10,277,201 B2pSemi Corporation
- Temperature compensated digital step attenuator19 Jun 2018US 10,003,322 B2pSemi Corporation
- Temperature-compensated PIN-diode attenuator17 May 2011US 7,944,323 B2Skyworks Solutions, Inc.
- Systems and methods for frequency equalization and temperature compensation in radio frequency devices20 Feb 2025US 2025/0062737 A1Smiths Interconnect Americas, Inc.
- Systems and methods for frequency equalization and temperature compensation in radio frequency devices27 Jun 2024US 2024/0213948 A1
- Systems and methods for frequency equalization and temperature compensation in radio frequency devices15 Dec 2022US 2022/0399870 A1Smiths Interconnect Americas, Inc.
- Digital step attenuator7 Oct 2021US 2021/0313967 A1Chengdu Sicore Semiconductor Corp. Ltd.
- Temperature Compensated Digital Step Attenuator13 Sep 2018US 2018/0262181 A1pSemi Corporation
Most cited
By later US patents
- Signal attenuators8US 6,472,949 B1Kabushiki Kaisha Toyoda Jidoshokki Seisakusho · 2002
- Temperature compensated digital step attenuator5US 10,003,322 B2pSemi Corporation · 2018
- Temperature compensation attenuator3US 7,528,677 B22009
- Temperature compensation attenuator2US 7,362,196 B2Yantel Corporation · 2008
- Temperature compensated digital step attenuator1US 10,277,201 B2pSemi Corporation · 2019