Systems and methods for frequency equalization and temperature compensation in radio frequency devices

An electronics package for a frequency equalizer comprising:

• a substrate having a first surface and a second surface;
• a ground plane disposed on the second surface;
• a coupler comprising:
• a main segment defined by a main strip disposed on the first surface and by said ground plane, said main segment extending between a first port and a second port;
• and
• a coupled segment defined by a coupled strip disposed on the second surface and by said ground plane, said coupled segment disposed in a coupling relationship with said main segment and extending between a third port and a fourth port;
• a first thermistor disposed on the first surface and electrically coupled in series between the first port and an input line;
• a second thermistor disposed on the first surface and electrically coupled in series between the second port and an output line;
• and
• a first shunt resistor disposed on the first surface and electrically coupled to the third port, wherein said electronics package simultaneously provides frequency equalization and temperature compensation for signals transmitted through said electronics package.

A method of manufacturing a frequency equalizer, said method comprising:

• forming a coupler including a main segment extending between a first port and a second port and a coupled segment disposed in a coupling relationship with the main segment and extending between a third port and a fourth port;
• electrically coupling a first thermistor in series between the first port and an input line;
• electrically coupling a second thermistor in series between the second port and an output line;
• and
• electrically coupling a first shunt resistor to the third port, wherein the frequency equalizer simultaneously provides frequency equalization and temperature compensation for signals transmitted through the frequency equalizer.