H02K 15/08

Forming windings by laying conductors into or around core parts

H02K15/08 (Forming windings by laying conductors into or around core parts) appears on 872 US grants and 861 published applications in this corpus.

Search patents in H02K
Granted patents
872
Published applications
861
Assignees
344
Inventors
1,834
Latest grant
6 Oct 2026

Filings by year

H02K 15/08: granted patents and published applications per publication year
YearGranted patentsPublished applications
197660
197770
197820
197960
198040
198150
198280
198330
198430
198540
198650
198770
198860
1989110
199090
1991100
1992150
1993210
1994130
1995110
1996170
1997110
199890
1999150
2000260
2001156
20021834
20032229
20042622
20051522
20061815
20071312
20081115
2009711
20101515
20111419
20121121
20131422
20141439
20151432
20162130
20173368
20183158
20195168
20204771
20215836
20225052
20233452
20244042
20252843
20261827

By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.

Subgroups

Granted patents

Recent patents

Most cited

By later US patents