H01J 9/48
With automatic transfer of workpieces between operating stations
Official title: with automatic transfer of workpieces between operating stations
H01J9/48 (With automatic transfer of workpieces between operating stations) appears on 53 US grants and 31 published applications in this corpus.
Search patents in H01J- Granted patents
- 53
- Published applications
- 31
- Assignees
- 35
- Inventors
- 95
- Latest grant
- 11 Apr 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 3 | 0 |
| 1979 | 3 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 4 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 1 |
| 2002 | 0 | 1 |
| 2003 | 2 | 3 |
| 2004 | 2 | 3 |
| 2005 | 2 | 4 |
| 2006 | 5 | 5 |
| 2007 | 2 | 3 |
| 2008 | 1 | 1 |
| 2009 | 1 | 3 |
| 2010 | 7 | 2 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 2 | 0 |
| 2014 | 0 | 1 |
| 2015 | 1 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 1 |
| 2021 | 1 | 1 |
| 2022 | 1 | 1 |
| 2023 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Bonding method for cleaning non-bonding surface of substrate11 Apr 2023US 11,626,302 B2Tokyo Electron Limited
- Bonding system with cleaning apparatus for cleaning non-bonding surface of substrate23 Aug 2022US 11,424,142 B2Tokyo Electron Limited
- Cathode structure for cold field electron emission and method of fabricating the same26 Oct 2021US 11,158,479 B2National University of Singapore
- Vertical pumping apparatus and method for distribution mercury in a pumping and lamp gas-filling process19 May 2015US 9,033,756 B2Auralight International AB
- Automatic spacers mounting system for field emission display and method of automatically mounting spacers25 Jun 2013US 8,469,073 B2Samsung Electronics Co., Ltd.
- Bonding method for cleaning non-bonding surface of substrate3 Nov 2022US 2022/0351987 A1Tokyo Electron Limited
- Cathode structure for cold field electron emission and method of fabricating the same27 May 2021US 2021/0159038 A1National University of Singapore
- Bonding system and bonding method17 Sep 2020US 2020/0294824 A1Tokyo Electron Limited
- Vertical pumping apparatus and method for distribution mercury in a pumping and lamp gas-filling process25 Sep 2014US 2014/0287645 A1Auralight International AB
- Automatic spacers mounting system for field emission display and method of automatically mounting spacers12 Jul 2012US 2012/0175036 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Method and apparatus for mounting a light sleeve62US 7,762,861 B2Orion Energy Systems, Inc. · 2010
- Use of printing and other technology for micro-component placement54US 6,796,867 B2Science Applications International Corporation · 2004
- Method of manufacturing a lamp24US 4,389,201 AGeneral Electric Company · 1983
- Miniature fluorescent lamp processing apparatus21US 5,384,709 ARockwell International Corporation · 1995
- Conveyor system for conveying panels and shadow masks10US 4,382,500 AHitachi, Ltd. · 1983